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YS05S16 DC-DC Converter Data Sheet
3.0-5.5 VDC Input; 0.7525-3.63 VDC Programmable @ 16 A
The
Products: Y-Series
Features
? RoHS lead-free solder and lead-solder-exempted
products are available
? Delivers up to 16 A (58 W)
? No derating up to 85 ? C
? Surface-Mount package
? Industry-standard footprint and pinout
? Small size and low profile: 1.30” x 0.53” x 0.314”
(33.02 x 13.46 x 7.98 mm)
? Weight: 0.22 oz [6.12 g]
Applications
? Coplanarity less than 0.003”, maximum
? Synchronous Buck Converter topology
?
?
?
?
?
Intermediate Bus Architectures
Telecommunications
Data communications
Distributed Power Architectures
Servers, workstations
? Start-up into pre-biased output
? No minimum load required
? Programmable output voltage via external resistor
? Operating ambient temperature: -40 °C to 85 °C
? Remote output sense
? Remote ON/OFF (positive or negative)
? Fixed-frequency operation
Benefits
? High efficiency – no heat sink required
? Reduces total solution board area
? Tape and reel packing
? Compatible with pick & place equipment
? Minimizes part numbers in inventory
? Auto-reset output overcurrent protection
? Auto-reset overtemperature protection
? High reliability, MTBF approx. 64.9 Million Hours
calculated per Telcordia TR-332, Method I Case 1
? All materials meet UL94, V-0 flammability rating
? UL60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN60950
Description
Power-One’s point-of-load converters are recommended for use with regulated bus converters in an Intermediate
Bus Architecture (IBA). The YS05S16 non-isolated DC-DC converter delivers up to 16 A of output current in an
industry-standard surface-mount package. Operating from a 3.0 – 5.5 V input, the YS05S16 converters are ideal
choices for Intermediate Bus Architectures where Point-of-Load (POL) power delivery is generally a requirement.
The converters provide an extremely tight regulated programmable output voltage from 0.7525 V to 3.63 V.
The YS05S16 converters provide exceptional thermal performance, even in high temperature environments with
minimal airflow. No derating is required up to 85 ? C, even without airflow at natural convection. This performance
is accomplished through the use of advanced circuitry, packaging, and processing techniques to achieve a design
possessing ultra-high efficiency, excellent thermal management, and a very low-body profile.
The low-body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
MCD10205 Rev. 1.0, 24-Jun-10
Page 1 of 25
www.power-one.com
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